奥地利专利AT513094A1 Device, in particular chip tool

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专利摘要:
Device (1), in particular cutting tool, machine with such a device (1) and method, with a cutting element (3) for machining a workpiece (2), wherein the cutting element (3) is connected to a vibrating device (5), which the cutting element (3) vibrated, whose frequency is lower than the frequency of ultrasound and wherein the oscillating device (5) has a in opposite direction to the cutting element (3) oscillating balance mass (6).
公开号:AT513094A1
申请号:T501062012
申请日:2012-03-28
公开日:2014-01-15
发明作者:
申请人:Univ Wien Tech；
IPC主号:

专利说明:

JPnrited: 29-03-2012 E014.1 Nfl ^ 0i # 501Q6.-1
The invention relates to a device, in particular a cutting tool, with a cutting element for the mechanical machining of a workpiece, wherein the cutting element is connected to a vibrating device, which is adapted to set the cutting element in a vibration whose frequency is lower than the frequency of ultrasound, and a machine for the mechanical processing of a workpiece, with a tool holder for the particular interchangeable arrangement of a device, in particular chip tool, for the mechanical machining of a workpiece. Furthermore, the invention relates to a method for machining a workpiece with a cutting element which is vibrated, wherein the frequency of the vibration of the cutting element is lower than the frequency of ultrasound.
In the prior art a variety of devices and methods for so-called hybrid processing or ultrasonic assisted processing are known. Here, a tool is usually vibrated in the ultrasonic range, wherein as the oscillation frequency, preferably the natural frequency of the tool is selected, so that deliberately resonant vibrations auftre-th, which in particular during the machining of a workpiece, a supporting effect is achieved.
A tool excited in the ultrasonic range is known for example from the publication "Modeling of material removal rate in rotary ultrasonic machining: designed experiments". by P. Hu, J.M.
Zhang, Z.J. Pei, and Clyde Treadwell, published in the Journal of Materials Processing Technology 129, 2002, 339-344. The excitation of the tool takes place in particular in the range of resonance frequencies, so that due to resonance effects, the amplitude of the vibration is amplified.
However, the excitation of the oscillation via resonance frequencies in the ultrasonic range is disadvantageously difficult to control; With a strong mechanical coupling between the tool and the workpiece, the resonance gain can be weakened, thereby losing the supporting effect of the vibration.
EP 0 197 172 A1 shows a method of the above-mentioned 2 Printed: 294) 3-2012 E014.1 102012/50106
Art, wherein a rotary tool along the line of feed vectors oscillates, so that the feed rate of the tool changes in the course of the workpiece rotation. The oscillation frequency is related to the rotational speed of the tool such that the wavelength or its integer multiple plus half a wavelength is equal to the respective workpiece circumference. The disadvantage here is in particular that a dynamic influence of the tool carrying device occurs, whereby this, in particular by suggestions of resonant frequencies, can be damaged.
In contrast, the present invention aims to provide an apparatus and a method for the mechanical machining of workpieces with which the vibration profile can be reliably controlled independently of resonance amplifications.
According to the invention this is achieved in that the oscillating device has a in the opposite direction to the Schneidel'emeht oscillating balancing mass. With the help of the cutting element counter-vibrating balancing mass thus a pulse decoupling can be achieved so that regardless of the natural frequency of the device any frequency for machining the workpiece can be adjusted. To compensate for the inertial forces of the cutting element, the balancing mass may have an identical to the cutting element mass; In this case, the balancing mass is vibrated at the same frequency and the same acceleration as the cutting element, but with opposite direction of movement. If the cutting element and balancing mass do not have the same mass, a compensating inertia effect can be achieved by adjusting the acceleration. If the balancing mass has a lower mass than the cutting element, it is therefore advantageous for pulse compensation if the balancing weight oscillates at the same frequency as and a larger amplitude than the cutting element. As a result, the balancing mass oscillates at the same frequency as the cutting element, but has a higher acceleration and thus travels a greater distance at the same frequency. Due to the comparatively high acceleration capacity, the pro-
- 3 - Printed: 29-03-2012 Έ014.1 10 2012/50106 zess reaction forces can be counteracted in an advantageous manner.
If the cutting element is put into a comparatively low-frequency oscillation, the oscillation profile can be reliably controlled, since the amplitude of the oscillation can be adjusted in a targeted manner via the stroke during the excitation of the oscillation. During machining, therefore, the desired oscillation amplitude can be maintained independently of the coupling between the tool and the workpiece, so that the supporting effect of the oscillation is reliably achieved. By the vibration of the cutting element, the mechanical machining of the workpiece can be supported in many ways. Mechanical operations in connection with the present invention are to be understood as meaning, in particular, any machining with geometrically defined or geometrically indefinite cutting edges; This includes in particular turning, drilling, milling, reaming and grinding, honing, lapping and polishing. In particular, the device may be similar to known devices in which the tooling is excited in the ultrasonic range to assist in the machining of difficult-to-machine materials, i. especially long-chipping or hard and / or brittle materials, e.g. Ceramic materials, in particular a variety of silicon materials, such as silicon nitride or silicon oxide, or glass, but also steel can be used.
According to a preferred embodiment, the device is designed as a chip removal tool. In the case of known cutting tools, it is possible during the machining of the workpiece to produce long, coherent flow chips which, for example, can impair the automatic operating sequences due to the formation of balls. In addition, chip chips can damage the workpiece surface; Furthermore, the chip removal is made more difficult. In contrast, due to the vibration of the cutting element comparatively short chips can be separated in the chip tool according to the invention, whereby the disadvantages of the conventional systems are overcome. For a variety of applications, it has proven to be favorable if the frequency of the oscillation of the cutting element
Printed: less than 10 kHz, preferably less than 5 kHz, in particular less than 1 kHz, particularly preferably between 500 Hz and 50 Hz. In contrast to known ultrasonic vibration devices, in which the achievement of a resonant vibration is desired, a resonance oscillation should be avoided in the device according to the invention, since this could lead to damage of the device.
To excite the oscillation of the cutting element, it is advantageous if the oscillating device has drive means acting in the oscillation direction of the cutting element or the compensating mass. Depending on the application, in principle a wide variety of drive means known in a different context in the prior art can be used, which are suitable for causing the oscillation of the cutting element at a frequency below that of ultrasound.
For selectively influencing the frequency of the oscillation of the cutting element, it is advantageous if the drive means of the oscillating device are connected to a control or regulating device which is adapted to control the oscillation of the cutting element, in particular the same as the oscillation of the balancing mass regulate. In a particularly simple embodiment, the vibration of the cutting element is merely controlled. In this case, the control device of a suitable control variable, in particular frequency and / or amplitude of the oscillation to a certain target size, which is handed down to the drive means of the vibrating device. Depending on the desired size of the control variable, the drive means is driven accordingly. However, the control device is preferably integrated in a feedback loop in order to be able to compensate for deviations of the actual oscillation profile from the desired oscillation.
In order to control the oscillation of the cutting element, it is advantageous if the measuring element and / or the balancing mass is assigned a measuring element, in particular a displacement and / or acceleration sensor, for measuring a characteristic oscillation variable whose measured values are transmitted as an actual variable to the control device. The control device compares the actual magnitude of the characteristic oscillation variable with a predetermined nominal value, the control difference being compensated.
In order to achieve vibrations of the workpiece holder in the desired frequency range in a simple and reliable manner, it is advantageous if the drive means of the oscillating device at least one piezoelectric element, in particular at least one piezoelement for driving the cutting element and at least one further piezoelectric element for driving the compensating mass , The piezoelectric element is supplied with electrical pulses which cause a periodic change in length of the piezoelectric element, which is converted into the oscillation of the cutting element or the compensating mass.
With regard to a simple control of the vibration of the cutting element and the leveling compound, it is advantageous if substantially the same type and number of piezoelectric elements acts on the leveling compound as on the cutting element.
According to a further preferred embodiment of the device is as a drive means of the vibrating device a fluid line having a linear drive, preferably a hydraulic or pneumatic pulser, is provided, which is coupled to excite the vibration with the cutting element or the balancing mass. In the prior art, a very wide variety of linear drives, in particular hydraulic pulser, were developed in another context, which are suitable for exciting vibrations in the desired frequency band. Such hydraulic pulpers are described, for example, in the article " Hydraulic Pulser " by H. Lohr-ent2, published in the journal "Ö + P - Ölhydraulik und Pneumatik". (1999), the entire contents of which are hereby incorporated by reference. The linear drive can be double-acting or single-acting. To form the linear drive, in particular, a compressed air tool may be provided, which is used in the prior art engraving pins. Preferably, the linear drive has an adjustable stroke frequency. In addition, as a drive means for the oscillating device and a mechanical drive, for example with a cam control, or an electromechanical drive can be provided. 'Printed: 29-03-2012 £ 014.1 10 2012/50106 - 6 -
To set the temporal pressure curve of the linear drive, it is advantageous if the fluid line of the linear drive has a control valve which is connected to the control or regulating device.
Sur power transmission to the cutting element, it is advantageous if the fluid line of the linear drive is in communication with a pressure chamber, which is connected to a displaceably mounted, coupled to the cutting element piston.
With regard to a structurally simple, reliable functioning embodiment, it is favorable if the pressure chamber is connected to a piston opposite the drive of the cutting element with another piston for driving the balancing mass. The fluid pressure in the pressure chamber is in this case converted into the displacement of the two pistons in opposite directions. Thus, the cutting element and the balancing mass can be driven via the common pressure chamber, so that can be dispensed with its own, second pressure chamber for the balancing mass. As a result, the design effort for the arrangement of the vibration device is reduced; In addition, the error rate of the linear drive is reduced, whereby the operating time can be extended. Another advantage of this embodiment is that only a single control signal is needed with which the pressure in the common pressure chamber is adjusted. As a result, the control or regulation of the vibration can be considerably simplified, as can be dispensed with a synchronization of separate control or control signals for the drive of the cutting element or the balancing mass.
To improve the vibration properties, it has proved to be favorable if at least one compressible fluid which can be filled with a compressible fluid and is provided for the cutting element or the balancing mass is provided, which dampens the vibration of the cutting element or the balancing mass during operation. Due to the compression chamber, the movement of the cutting element or the compensating mass can be slowed down, in particular when reaching the end positions of the movement process. The lifting movement of the cutting element or the compensating mass iPrinted: 29-03-2012 E014.1 10 2012/50106 - 7 - Compresses the fluid contained in the compression chamber, whereby a damping effect is achieved by the internal friction of the fluid. In this case, a pressure prevailing in the compression chamber of the fluid can be discharged via a throttle to the outside. According to a preferred embodiment, two compression chambers are provided, which are associated with the vibration of the cutting element or the opposite vibration of the balancing mass.
To adapt the damping properties, it is advantageous if the filling pressure of the compression chamber is variable via a supply with a control valve. Due to the control valve, the base pressure in the compression chamber can be adjusted, so that the damping force can be varied depending on the requirements of the respective machining operation.
According to a preferred application, the cutting element is designed as a turning tool, the oscillation of the cutting element taking place in the longitudinal direction of the turning tool. The vibration of the cutting element can be used to separate comparatively short chips from the workpiece, whereby the chip removal is considerably facilitated. However, the advantages of the invention can also be used with other tools (e.g., drills, cutters, etc.).
Particular advantages also include a machine for the mechanical processing of a workpiece, which is equipped with the device described above in the manner of a cutting tool. The machine has a tool holder in which the device is installed. The device is in this case preferably designed as an insert, which can be arranged exchangeable in the corresponding tool holder of the machine. Machines with suitable tool holders are known in the prior art in various designs, for example as a turning or milling machine. The integration of the oscillating device in the insert part has the advantage that existing machines can be retrofitted.
In order to be able to install the device according to the invention in an existing machine with little effort, it is favorable if the linear drive of the oscillating device is connected to an operating fluid line of the machine, in particular a hydraulic line or a cooling lubricant line is connected. The known machines often have a suitable loading fluid line, which can be used to supply the linear drive of the vibrating device.
The method for machining a workpiece of the type mentioned above is characterized in that a leveling compound is set in oscillation in the opposite direction to the cutting element. Due to the oscillation of the balancing mass, which runs counter to the oscillation of the cutting element, resonance oscillations are avoided since the pulse transmitted by the oscillation of the cutting element is thus actively decoupled.
To influence the machining process, it is advantageous if the frequency of the oscillation of the cutting element is below 10 kHz, preferably below 5 kHz, in particular below 1 kHz, particularly preferably between 500 Hz and 50 Hz.
According to a particularly preferred embodiment, in a turning operation, a chip is separated from a rotating workpiece, wherein the oscillation of the cutting element is synchronized with the rotation of the workpiece such that a wave crest of a wave-shaped course of the penetration depth of the cutting element into the workpiece at a separation point with a trough a wave-shaped course of the surface of the lifted chip coincides. As a result, relatively short chips are separated, so that the formation of flow chips, which complicate the operation and can pose a security risk is reliably avoided. Due to the synchronization of the vibration with the rotation of the workpiece, a reliable separation of the chips can be achieved even at higher feeds.
The invention will be explained in more detail below with reference to preferred embodiments illustrated in the drawings, to which, however, it should not be restricted. In one
Printed: 29-03-2012 € 014.1 10 2012/50106 - 9 - no show in the drawings:
1 shows a sectional view of a device according to the invention for processing a workpiece;
Fig. 2 is a sectional view of a device according to another embodiment of the invention; and
FIG. 3 schematically shows the principle when cutting short chips with a device in the manner of a turning tool according to FIG. 1 or FIG. 2.
In Fig. 1, a device 1 for the mechanical processing of a (schematically drawn) workpiece 2 is shown, which is designed in the embodiment shown as a turning tool. The device 1 has a cutting element 3 with a cutting edge 4, with which chips are lifted off the surface of the workpiece 2 after the workpiece 2 has been set in rotation.
In turning with conventional cutting tools, chip chips, i. long, coherent chips formed, which may affect the operation. In contrast, the cutting element 3 of the device 1 shown is connected to a vibrating device 5, which is accommodated in a schematically shown housing 7 of the device 1. The oscillating device 5 is set up to set the cutting element 3 in a vibration or in a vibrating motion. For a variety of applications, it has proven to be advantageous if the frequency of the vibration of the cutting element between 500 Hz and 50 Hz, i. a frequency lower than the frequency of ultrasound. In particular, mechanical processing of hard and / or brittle materials, such as e.g. Ceramic materials, in particular a variety of silicon materials such as silicon nitride or silicon oxide, or glass, but also hardened steel or the like can be supported.
As can be seen from Fig. 1, the vibration of the cutting element 3 takes place in the longitudinal direction 1 'of the device 1, which the iPrinted: 29-03-2012 E014.1 10 2012/50106 - 10 -
Feed direction of the cutting element 3 corresponds (see double arrow 6). The rotational movement of the workpiece 2 relative to the cutting edge 4 of the cutting element 3 is thus superimposed on a periodic movement of the cutting element 3 substantially perpendicular to the surface of the workpiece 2. As a result, comparatively short chips can be separated during the turning of the workpiece 2, as will be explained in more detail in connection with FIG. This has the advantage that the removal of the chips can be significantly improved. In addition, the security risk can be reduced due to flying around, relatively long flow chips. On the one hand, this safety risk is that longer chips could cause damage to the tool or workpiece; In addition, the operating personnel of the tool could be endangered.
As further seen in FIG. 1, the oscillating device 5 has a balancing mass 6 oscillating in the opposite direction to the cutting element 3, with which the inertial pulses introduced by the oscillating cutting element 3 are actively decoupled. To excite the vibration, the oscillating device 5 in the direction of vibration of the cutting element 3 and in the direction of the vibration of the balancing mass 6 acting drive means.
1, the drive means of the oscillating device 5 according to FIG. 1 have a piezoelectric element 8 for driving the cutting element 3 and a further piezoelectric element 8f for driving the compensating mass 6. In the embodiment shown, substantially identical, rod-shaped piezo elements 8, 8 'are provided. The piezoelectric element 8 is coupled to the cutting element 3. The application of a suitable electrical voltage to the piezoelectric element 8 causes a periodic change in length, which is converted into the oscillation of the cutting element 3. The further piezoelectric element 8 'is coupled to the compensating mass 6, so that the compensating mass 6 is offset by a periodic change in length of the further piezoelectric element 8' in a gegengleiche oscillation. In the embodiment shown, the piezoelectric element 8 is wound with a helical spring 9, which counteracts the longitudinal expansion of the piezoelectric element 8. In addition, a return spring 10 can be seen from FIG.
Printed: 29-03-2012 £ 014.1 10 2012/50106 - 11 -
Shifting the balancing mass 6 from the rest position causes a restoring force. On the other hand, in an embodiment (not shown), two piezoelectric elements acting in opposite directions may be provided instead of one piezoelectric element 8 or 8 ', so that the arrangement of a spring element for returning the drive means to the starting position can be dispensed with.
As further schematically shown in FIG. 1, the drive means of the oscillating device 5 are connected to a control or regulating device 11, which controls or controls the oscillation of the cutting element 3 in opposition to the oscillation of the balancing mass 6. According to FIG. 1, a generator 13, which supplies the piezo elements 8, 8 'with suitable electrical pulses, is controlled via the control or regulating device 11.
The electrical pulses are synchronized with one another in such a way that the desired counter-vibration of cutting element 3 and compensating mass 6 is produced.
As further seen in Fig. 1, the cutting element 3 is connected to a measuring element 12, so that a control loop is closed. The measuring element 12 continuously detects a characteristic vibration quantity. The measured values of the oscillation variable are transferred as an actual variable to the control device 11 in order to determine a control deviation by comparison with a predetermined desired value, which is compensated by corresponding control of the drive means. As a measuring element 12, in particular, a displacement and / or acceleration sensor is provided, which receives the path traveled by the cutting element 3 and / or its acceleration. As indicated in FIG. 1 by dashed lines, a further measuring element 12 'assigned to the balancing mass 6 is preferably provided in order to detect a characteristic oscillation variable associated with the balancing mass 6, independently of the signal of the measuring element 12. Accordingly, an actively controlled pulse decoupling can be achieved over which reliable resonant vibrations can be avoided.
2, a further embodiment of the invention is shown, wherein in the following only the differences from FIG. 12 I will be discussed. The embodiment according to FIG. 2 has as drive means a linear drive 13, in particular in the form of a hydraulic or pneumatic pulser, which is coupled to excite the vibration with the cutting element 3 and with the balancing mass 6. The linear drive 13 has a (schematically illustrated) fluid line 14, in which a preferably electromechanical control valve 15 is arranged with an actuator 15T, which is controlled via the control or regulating device II.
As can be seen from FIG. 2, the fluid line 14 of the linear drive 13 via the control valve 15 into a pressure chamber 16 within the housing 7 of the device 1. The pressure chamber 16 communicates with a in the feed or longitudinal direction 1 'of the cutting element 3 slidably mounted piston 17 in connection, which is coupled to the cutting element 3. The pressure chamber 16 is controlled via the control or regulating device 11 with a periodic pressure curve, which is transmitted via the piston 17 to the cutting element 3 in order to set the cutting element 3 in the desired oscillation.
As further shown in FIG. 2, a further piston 1, displaceably mounted in the longitudinal direction 1 'of the device 1, is provided on a side of the pressure chamber 16 opposite the piston 17 for driving the cutting element 3, which is arranged to drive the compensating mass 6. The fluid pressure in the pressure chamber 16 can therefore be converted into the displacement of the pistons 17, 18 in opposite directions, so that a diametrical oscillation of the cutting element 3 and compensating mass 6 is achieved. According to FIG. 2, the additional piston 18 which is coupled to the compensating mass 6 is also displaceably mounted in the piston 17 via a guide 19.
As further apparent from Fig. 2, spring elements 20 are arranged between the piston 17 and the housing 7, which counteract the displacement of the piston 17 from its output läge. For resetting the further piston 18, corresponding spring elements 20 are provided, which act between the further piston 18 and the housing 7. - 13 - IPrinted: 29-03-2012 £ 014.1 10 2012/50106
2, the housing 7 of the device 1 in each case has a compression element 21 or 21 'associated with the cutting element 3 or the equalizing mass 6, which has a feed 14' or 14 '' with a compressible base -ren fluid is supplied. The supply 14 * or 14 '' has in each case a control valve 22 or 23, each with an actuator 22 'or 23'. The damping chambers 21 and 21 'allow a targeted damping of the vibration of the cutting element 3 and the compensating mass 6. The damping properties can be influenced by the filling pressure of the compression chamber 21 and 21', which is specified by the control or regulating device 11 ,
The device 1 described above can be used in conjunction with a machine, for example a turning system or a combined turning / milling machine, which has a suitable tool holder for the device 1. In the embodiment of the device 1 according to FIG. 2, it is advantageous in this case if an already existing operating fluid line of the "machine", in particular a hydraulic line or a cooling lubricant line, is used to supply the linear drive 13. Thus, the device 1 can be retrofitted with little effort.
In Fig. 3, the principle of operation of the device 1 during the separation of a comparatively short chip 24 from the workpiece 2 is illustrated. The cutting element 3 is set in vibration by means of the oscillating device 5, which, as described above, has a frequency below that of ultrasound. The oscillation of the cutting element 3 causes a time-dependent pressing force Fd (t) of the cutting element 3, so that the penetration depth of the cutting element 3 follows a wave-shaped course xd (t), which depends on the amplitude and the frequency of the oscillation. The surface of the lifted chip 24 has a corresponding, but with respect to the rotation time T of the rotational movement of the workpiece 2 by a length E shifted wave-shaped course xd (t-T). For comparison, a constant chip thickness hs is indicated in FIG. 3 by dashed lines, which would be achieved with a constant contact pressure. The oscillation of the cutting element 3 is synchronized with the rotation of the workpiece 2 by means of the control device 10 such that a wave crest 25 of the wave-shaped path xd (t) of FIG Penetration depth of the cutting element 3 in the workpiece 2 at a separation point 27 coincides with a wave trough 26 of the wave-shaped course xd (tT) of the surface of the lifted chip 24. Thus, a chip 24 is obtained with a periodically tapered cross-section, which can be solved at each separation point 27. Thus, during a revolution of the workpiece 2, a plurality of comparatively short chips 24 can be separated.

权利要求:
Claims (19)
[1]
Claims 1. A device (1), in particular a cutting tool, with a cutting element (3) for machining a workpiece (2), wherein the cutting element (3) is connected to a vibrating device (5) which is adapted to the cutting element (3) to set in a vibration whose frequency is lower than the frequency of ultrasound, characterized in that the oscillating device (5) in a direction opposite to the cutting element (3) oscillating balancing mass (6).
[2]
2. Device (1) according to claim 1, characterized in that the frequency of the oscillation of the cutting element (3) is less than 10 kHz, preferably less than 5 kHz, in particular less than 1 kHz, more preferably between 500 Hz and 50 Hz ,
[3]
3. Device (1) according to any one of claims 1 or 2, characterized in that the oscillating device (5) in the direction of vibration of the cutting element (3) or the compensating mass (6) acting drive means.
[4]
4. Device (1) according to claim 3, characterized in that the drive means of the oscillating device (5) with a control or. Control device (11) are connected, which is adapted to control the vibration of the cutting element (3), in particular against the same vibration of the balancing mass (6), or to regulate.
[5]
5. Device (1) according to claim 4, characterized in that the cutting element (3) and / or the compensating mass (6) is associated with a measuring element (12, 12T) / in particular a displacement and / or acceleration sensor, for measuring a characteristic vibration magnitude is whose measured values are transmitted as actual size to the control device (11}.
[6]
6. Device (1) according to one of claims 3 to 5, characterized in that the drive means of the oscillating device at least one piezoelectric element (8; 8 '), in particular at least one piezoelectric element (8) for driving the cutting element (3) and at least 16 - Printed: 29-03-2012 E014.1 10 2012/50106 at least one additional piezo element {8 ') for driving the leveling compound (6).
[7]
7. Device (1) according to claim 6, characterized in that on the balancing mass {6) substantially the same type and number of piezoelectric elements (8, 8 ') acts as on the cutting element (3).
[8]
8. Device (1) according to one of claims 3 to 5, characterized in that as drive means of the oscillating device (5) a fluid line (14) exhibiting linear drive (13), preferably a hydraulic or pneumatic pulser, is provided for excitation the oscillation with the cutting element (3) or the compensating mass (6) is coupled.
[9]
9. Device (1) according to claim 8, characterized in that the fluid line (14) of the linear drive (13) has a control valve (15) which is ally with the control or regulating device (11).
[10]
10. Device (1) according to claim 9, characterized in that the fluid line (14) of the linear drive (13) with a pressure chamber (16) is in communication with a displaceably mounted, with the cutting element (3) coupled to the piston (17 ) connected is.
[11]
11. Device (1) according to claim 10, characterized in that the pressure chamber (16) on a piston (17) for driving the cutting element (3) opposite side with a further piston (18) for driving the balancing mass (6) is.
[12]
12. Device (1) according to one of claims 1 to 11, characterized in that at least one can be filled with a compressible fluid, the cutting element (3) or the compensating mass (6) associated compression chamber (21; 21 ') is provided which dampens the vibration of the cutting element (3) or the compensating mass (6) during operation.
[13]
13. Device (1) according to claim 12, characterized in that the filling pressure of the compression chamber (21, 21 ') via a feed (14', 14 ') is filled by the filling pressure of the compression chamber (21, 21'). T) with a control valve (22, 23) is variable.
[14]
14. Device (1) according to one of claims 1 to 13, characterized in that the cutting element (3) is designed as a turning tool, wherein the vibration of the cutting element (3) in the longitudinal direction (1 ') of the turning tool.
[15]
15. Machine for the mechanical processing of a workpiece, with a tool holder for the particular exchangeable arrangement of a device, in particular chip tool, for the mechanical machining of a workpiece, characterized in that in the tool holder, a device (1), in particular chip tool, for the mechanical machining of a workpiece ( 2) is arranged according to one of claims 1 to 15.
[16]
16. Machine according to claim 15 with claim 8, characterized in that the linear drive (13) of the oscillating device (5) to an operating fluid line of the machine, in particular a hydraulic line or a cooling lubricant line, is connected.
[17]
17. A method for machining a workpiece (2) with a cutting element (3), wherein the cutting element (3) is vibrated and the frequency of the oscillation of the cutting element (3) is lower than the frequency of ultrasound, characterized in that a balancing mass (6) is set in oscillation in the opposite direction to the cutting element (3).
[18]
18. The method according to claim 17, characterized in that the frequency of the oscillation of the cutting element (3) is less than 10 kHz, preferably less than 5 kHz, in particular less than 1 kHz, more preferably between 500 Hz and 50 Hz.
[19]
19. The method according to claim 17 or 18, characterized in that in a turning machining a chip (24) is separated from a rotating workpiece (2), wherein the vibration of the cutting element (3) so with the rotation of the workpiece (2) Printed: 29-03-2012 £ 014.1: 10 2012/50106 - 18 - that a wave crest (25) of a wave-shaped course (xd (t)) of the penetration depth of the cutting element (3) into the workpiece (2) at a separation point ( 27) coincides with a wave trough (26) of a wave-like course (xd (tT)) of the surface of the lifted chip (24).

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同族专利:

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引用文献:

公开号 | 申请日 | 公开日 | 申请人 | 专利标题

EP0197172A1|1985-04-09|1986-10-15|Wilhelm Hegenscheidt Gesellschaft mbH|Device to obtain broken chips during the machining of work pieces|

EP0323518A1|1987-06-24|1989-07-12|Research Development Corporation Of Japan|Device for vibrating work to be ground|

DE102006049867A1|2006-10-23|2008-04-24|Siemens Ag|Machine tool, has workpiece clamping device for clamping workpiece, where clamping device and workpiece are movable opposite to workpiece table by piezoactuators and speed of clamping device is determined by acceleration sensor|

EP2269781A2|2009-07-02|2011-01-05|Robert Bosch GmbH|Device for reduction and/or compensation of vibrations, in particular for a handheld machine tool and for use in handheld machine tools|

US3757638A|1972-04-12|1973-09-11|J Martin|Five-axis shaper|

CH638587A5|1979-02-12|1983-09-30|Uster Spindel Motoren Maschf|HAMMER.|

IL105743D0|1992-06-11|1993-09-22|Dov Shilkrut|Penetrating tool system|

EP2119536B1|2003-03-21|2017-08-23|Black & Decker Inc.|Power tool incorporating vibration reduction apparatus|

JP4771054B2|2005-05-30|2011-09-14|コニカミノルタオプト株式会社|Vibration cutting apparatus, molding die, and optical element|

JP2006334732A|2005-06-02|2006-12-14|Konica Minolta Opto Inc|Cutting tool, cutting method, cutting device, mold for forming optical element, optical element and cutting method for mold for forming optical element|

US7234379B2|2005-06-28|2007-06-26|Ingvar Claesson|Device and a method for preventing or reducing vibrations in a cutting tool|

DE102008000908A1|2008-04-01|2009-10-08|Robert Bosch Gmbh|Against vibrator|HUE032837T2|2011-07-19|2017-11-28|Mauser-Werke Oberndorf Maschb Gmbh|Adjustment system|

DE102015101167A1|2015-01-27|2016-07-28|Technische Universität Wien|spindle assembly|

DE102015105338A1|2015-04-08|2016-10-27|Lti Motion Gmbh|Tool drive with spindle shaft and operating method|

法律状态:
2020-11-15| MM01| Lapse because of not paying annual fees|Effective date: 20200328 |

优先权:

申请号 | 申请日 | 专利标题

AT501062012A|AT513094B1|2012-03-28|2012-03-28|Device, in particular chip tool|AT501062012A| AT513094B1|2012-03-28|2012-03-28|Device, in particular chip tool|

PCT/AT2013/050076| WO2013142890A1|2012-03-28|2013-03-27|Device, machine and method for mechanically machining a workpiece|

DE201311001707| DE112013001707A5|2012-03-28|2013-03-27|Device, machine and method for machining a workpiece|

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